Interconnect Stress Testing is an accelerated temperature cycling method to
predict the reliability of both plated thru vias and internal board
interconnects (posts).  The technique uses both special electrical
input/heating equipment and a standard board coupon containing holes and
internal layer interconnects.  The projection made is 1000 hour thermal
cycling performance with data taken in a day or two over hundreds of fast
cycles (before boards leave the fabrication shop).

IST is one of the techniques Foster Gray's IPC Post Separation Task Group is
evaluating as a test method.  IST was also used as one technique in the
recent evaluation of direct metallization technology presented at IPC Expo.

For details, contact

PWB Interconnect Solutions, Inc
P.O. Box 23022
Ottawa, Ontario, Canada  K2A 4E2
Phone/Fax  819-684-9849

We at MacDermid have participated with CircoCraft in the past in testing the
technique by deliberately making boards with and without post separation.  We
regard passing IST testing as a criteria for any new electroless or direct
metallization we develop.

Denny Fritz
MacDermid - Waterbury, Connecticut



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