I have some basic questions about Ball Grid Array.  

First, despite all the hype about BGA, where are BGA packages used NOW in
real applications, e.g. what ASICs and the like?  

Second, concerning the placement of solder balls on the substrate, has
anyone evaluated the best (automated) process for this?  It is my
understanding that Motorola and Shibuya have machines using some sort of
vacuum procedure, and that a company called Vanguard Automation has a
patented gravity procedure for ball placement that seems to work better
(higher yields, faster cycle times) than other machines?  Are there any
alternative, better methods in the works somewhere?  

Any thoughts on these issues would be greatly appreciated.

--DFH

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