TECHNET Archives

1996

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
<[log in to unmask]> (Steve Sparkowich)
Date:
Mon, 28 Oct 96 8:55:11 PST
Content-Type:
text/plain
Parts/Attachments:
text/plain (26 lines)
Goal: Solderability testing which most pleases our SMT customers? 
 
A. Which solderability test method (i.e. Wetting Balance, SERA, IPC Edge 
Dip, etc.) do you want your PCB/PWB vendor to conduct on Electroless 
Ni/Immersion Au boards? 

B. How do you screen incoming lots of boards for solderability?

C. How do you use PCB/PWB solderability testing to improve SMT? 

Thanks in advance for your input!

Steve Sparkowich
Sr. Process Engr.
[log in to unmask]
Ph. 503-359-9300 ext.54653

***************************************************************************
* TechNet mail list is provided as a service by IPC using SmartList v3.05 *
***************************************************************************
* To unsubscribe from this list at any time, send a message to:           *
* [log in to unmask] with <subject: unsubscribe> and no text.        *
***************************************************************************



ATOM RSS1 RSS2