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| From: | "Jim Marsico" <"marsico%Organization=Industrial & Mfg'g Engineering%Telephone=516-595-5879"@a1.allin1.ALLIN1.umc> |
| Date: | Mon, 26 Feb 96 13:59:01 -0500 |
| Content-Type: | text/plain |
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Reflowing solder paste on fiducials and in-circuit test pads shouldn't cause
any problems. We've been performing ICT on assemblies with solder on the test
pads for years. I can't speak for all, but I know that the majority of
component placement systems can read solder coated fiducials quite well.
Jim Marsico
[log in to unmask]
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