A few weeks back I inquired to the gold finish suppliers, the following
questions regarding solderability assessment and controls for Electroless gold.

1) What solderability test methods are recommended for these products?
2) Is the IPC in the process of capturing these requirements?
3) Is there an 'optimum' manufacturing/storage condition to minimize or
hopefully eliminate solderability concerns?
4) Is it implied that only ONE soldering process can be used with immersion
gold finishes thereby precluding the use of double sided SMD?
5) How accurate is the measurement of gold in the ranges typically quoted in
immersion gold thicknesses (ie 2-6 microinches)? Is this measured by weight
gain? XRF? 

There was limited response and NONE from the suppliers of these processes. I
would be interested to hear if your "limited success" relates to
solderability???

Dave Rooke
Circo Craft - Pointe Claire

______________ reply separator __________
>
>   I am currently venturing into the world of pcb metallic finishes.  I
have acquired some pcb's with immersion gold on them and have met with what
seems to be limited success.  I was wondering if there are any tricks of the
trade for processing these style boards thru a conventional SMT/Wave solder
process?  If a different formulation other than 63/37 solder paste is
recommended? and who it stacks up to the OSP coatings?
>
>
>	Stephen Weldon
>	Manufacturing Engineer
>	Diagnostic Instrument Co.
>	[log in to unmask]
>
>
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