Last month there were some brief discussions of resist adhesion.  Using 
ASTM D3359-87(a cross-hatch test) was suggested.

My questions are:

1)  is anyone using such a test for testing acceptance of laminated 
photoresist?

2)  is anyone using such a test for process control in lamination or 
exposure or developing of photoresist?

3)  what defects can appear if adhesion is too low?

4)  what defects can appear if adhesion is too high?

I would like to discuss these with any interested parties.

Lou Hart
412-858-6117
compunetics
.