Kevin,
    Using LPI in an attempt to tent vias does lead to exposed copper which 
could be an issue in some extreme environments.  The bigger concern with 
this process in my opinion is entrapment of any chemistries that the board 
is exposed to after the LPI has been applied.
     When LPI is applied, typically on the first side the vias will be 
tented (sealed off) but on the second side a percentage will either be open 
or have a pin hole in the tent.  The ones with the pin holes can suck in 
liquids (fluxes, cleaners, etc.) that can not be removed by subsequent 
cleaning processes.  These chemicals are now trapped in a copper lined cup, 
that at some point can corrode into an open via.
     While there are several alternatives that use addition processing steps 
and add to your costs, a single application of LPI on each side will result 
in the potential for chemical entrapment.  On Au/Ni boards, the only 
difference would be the added layer of nickel over the copper.

     Norm Dill
     Harris RF Communciations
     [log in to unmask]

_________________________________
Subject: Re[2]: Soldermask Tented Vias
Author:  [log in to unmask] at corp
Date:    6/19/96 3:53 PM


     Rodger -

     I vote for your suggestion! If you look at an assembly with solder
     mask closely, one will find that the sidewalls of many surface
     features are bare copper. I think that the electronics industry in
     general has quite a bit of exposed copper functioning in the field
     with few problems. The exposed copper issues I have been working seems
     to be a "culture" issue (military product primarily) - the standard
     question has been "won't it corrode if the copper is exposed?. There
     will be design and use environment specific cases where bare copper
     will be a problem but overall there are gains to be realized. Using
     bare copper would mean that the printed wiring board would see one
     less thermal excursion (no HASL or Refuse operation) which can only be
     a good thing from a reliability standpoint. Lee Parker of AT&T gave me
     a paper on the corrosion of exposed copper in several environments
     over a 30 year period - if I can find that paper I'll post it here on
     TechNet. Well TechNet - anyone else in support of bare copper?


     Dave Hillman
     Rockwell Collins
     [log in to unmask]



______________________________ Reply Separator
_________________________________
Subject: Re: Soldermask Tented Vias
Author:  [log in to unmask] at ccmgw1
Date:    6/19/96 10:05 AM


     I don't know much about your soldermask issue, but I would like to see
     some discussion of the exposed copper issue.

     We have felt for a long time that any exposed copper was unacceptable
     but with the industry switching over to OSP more and more, we have to
     accept a limited amount of copper exposure (when SMT pads don't get
     paste).  If you are making SMT-only boards which don't flow across a
     wave solder then the amount of exposed copper goes up tremendously.  I
     recently talked to people at a company which is very prominent in the
     electronics industry and has been allowing a large amount of exposed
     copper on their PCB assemblies (look inside your PC and see how much
     exposed copper you can find).  They have done a significant amount of
     temperature and life testing and have seen no problems due to exposed
     copper.

     If this is true, isn't it time to stop worrying about exposed copper
     and start making boards and assemblies cheaper?

     Regards,

     Roger Held
     Hitachi Computer Products (America), Inc.


______________________________ Reply Separator
_________________________________
Subject: Soldermask Tented Vias
Author:  [log in to unmask] at Internet-HICAM-OK
Date:    6/19/96 8:48 AM



Good Morning,

We usually require soldermask over bare copper and tented vias (less than
.020").  This typically means that the soldermask is dry film.  If a tented
via is not required and liquid soldermask is used, it appears that the
soldermask is suspect to flake off near the via knee, leaving a small amount 

of exposed copper.

Is liquid solder mask over bare copper compliant with vias when the plating
is eletroless nickel - immersion gold?

Does the plating type matter?

Is the suspect of exposed copper a non-issue?

Thank you in advance of any comments.

Kevin Thorson
Lockhead Martin
Eagan, Mn