TECHNET Archives

1996

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
"ddhillma" <[log in to unmask]>
Date:
Tue, 10 Dec 96 08:54:33 cst
Content-Type:
text/plain
Parts/Attachments:
text/plain (175 lines)
     Good Morning TechNet!
     
     An apology is in order. I am a big advocate of the  non advertisement 
     nature of the TechNet forum and Bob Willis's posting hit a bit too 
     close to what I consider commercialism. Sorry for the less than 
     professional expression of my thoughts to the TechNet forum and  to 
     Bob Willis (I was having a less than wonderful Monday which should 
     have enough of a warning to have a soda instead of trying to 
     contribute to TechNet!).
     
     
     Dave Hillman
     Rockwell Collins
     [log in to unmask]
     


______________________________ Reply Separator _________________________________
Subject: Re: Nepcon Workshops 1997
Author:  [log in to unmask] at ccmgw1
Date:    12/9/96 9:01 PM


Tue 10th Dec 1996 9:27am (+0800)
     
I take your sentiment, but thought the tone of your reply was a trifle 
brusque. FWIW, I know for a fact that Bob Willis regularly contributes 
technical feedback to all members through this Technet forum. Further, he 
runs such workshops at various locations and events, including Nepcon (UK), 
where they are either free, or at least are run to generate money for 
charity. I don't know whether this will be the case at Nepcon West 97, but 
I'm nevertheless sure that a less curtly worded message would have been 
equally effective. I enjoy the forum because of its friendliness, as well 
as its usefulness.
     
Yours,
     
Gordon Wong
     
___________________________________________ 
###########################################
 Dr Gordon Wong                   
 TechWorks Asia, Hong Kong        
 Reply to: [log in to unmask]   
   Tel/Fax: (852) 2524 4956         
___________________________________________ 
###########################################
     
     
At 04:02 PM 09-12-96 cst, you wrote:
>     If I needed to see an NEPCON Ad I could look at a NEPCON program 
>     flyer! Keep the advertisement off TechNet and stick to the technical 
>     format.
>
>
>______________________________ Reply Separator 
_________________________________
>Subject: Nepcon Workshops 1997
>Author:  [log in to unmask] at ccmgw1
>Date:    12/9/96 3:41 PM
>
>
>Here are the workshops I will be conducting at Nepcon West in the USA if 
any one
>feels that a trip to the sun is of benefit. 
>     
>This will be my 8th year at Nepcon West it will be time for my Gold Watch 
soon I
>also love the sun we get so little in the UK. 
>     
>     
>Wave Soldering Surface Mount Boards with Zero Defects - Half Day 25th Feb 
>     
>Soldering Materials for SMT - Fluxing for Conventional and Low Solids - 
Pre Heat
>Measurement Solder Waves for SMT - Process Control Testing - Establishing 
>Process Settings - SMT Soldering Standards - Defect Analysis Clinic
>     
>     
>X-Ray Inspection of Fine Pitch and BGA - Half Day 25th Feb 
>     
>Introduction to x ray inspection - Equipment requirement - Selection 
criteria - 
>Inspection standards - BGA - Gull wing - J Lead - Chip terminations - 
Process 
>defects - Operator training
>     
>     
>Design For Manufacture and Assembly - 24th Feb 
>     
>Component selection and specification-Fine pitch and Ball Grid Array-PCB 
>specification-Laminate selection-Track and hole sizes-Pad and stencil 
>apertures-Pad sizes for conventional and SMT Resist selection for no 
>clean-Solder finish and cost reduction-Multi panel design-Design reviews 
Layout 
>for small and volume production-Process problems and solutions through design 
>     
>     
>Introduction to Ball Grid Array Design and Assembly - 25th Feb 
>     
>BGA advantages and disadvantages-BGA suppliers-Design rules-Printed board 
>layout-Pad and resist footprints-Surface finish 
selection-Inspection/assembly 
>marks-Assembly process-Solder paste printing Flux reflow methods-Temperature 
>profiling-Reflow by convection and vapour phase-Moisture removal Rework 
>procedures-BGA failures-Package cracking-Missing balls-Solder 
>balls-Misalignment-Non reflow-Inspection criteria-Production trial results
>     
>Further information is available from the Nepcon Home Page. 
>     
>Bob Willis
>Process Engineering Consultant
>Electronic Presentation Services
>2 Fourth Avenue, Chelmsford, Essex CM1 4HA. England. 
>Tel: (44) 01245 351502
>Fax: (44) 01245 496123
>Home Page: http://ourworld.compuserve.com/homepages/Bwillis 
>Email: [log in to unmask]
>     
>     
>*************************************************************************** 
>* TechNet mail list is provided as a service by IPC using SmartList v3.05 * 
>*************************************************************************** 
>* To unsubscribe from this list at any time, send a message to:           * 
>* [log in to unmask] with <subject: unsubscribe> and no text.        * 
>*************************************************************************** 
>* If you are having a problem with the IPC TechNet forum please contact   * 
>* Dmitriy Sklyar at 847-509-9700 ext. 311 or email at [log in to unmask]      * 
>*************************************************************************** 
>     
>
>*************************************************************************** 
>* TechNet mail list is provided as a service by IPC using SmartList v3.05 * 
>*************************************************************************** 
>* To unsubscribe from this list at any time, send a message to:           * 
>* [log in to unmask] with <subject: unsubscribe> and no text.        * 
>*************************************************************************** 
>* If you are having a problem with the IPC TechNet forum please contact   * 
>* Dmitriy Sklyar at 847-509-9700 ext. 311 or email at [log in to unmask]      * 
>*************************************************************************** 
>
>
>
___________________________________________ 
###########################################
 Dr Gordon Wong                   
 TechWorks Asia, Hong Kong        
 Reply to: [log in to unmask]   
   Tel/Fax: (852) 2524 4956         
___________________________________________ 
###########################################
     
*************************************************************************** 
* TechNet mail list is provided as a service by IPC using SmartList v3.05 * 
*************************************************************************** 
* To unsubscribe from this list at any time, send a message to:           * 
* [log in to unmask] with <subject: unsubscribe> and no text.        * 
*************************************************************************** 
* If you are having a problem with the IPC TechNet forum please contact   * 
* Dmitriy Sklyar at 847-509-9700 ext. 311 or email at [log in to unmask]      * 
***************************************************************************
     

***************************************************************************
* TechNet mail list is provided as a service by IPC using SmartList v3.05 *
***************************************************************************
* To unsubscribe from this list at any time, send a message to:           *
* [log in to unmask] with <subject: unsubscribe> and no text.        *
***************************************************************************
* If you are having a problem with the IPC TechNet forum please contact   *
* Dmitriy Sklyar at 847-509-9700 ext. 311 or email at [log in to unmask]      *
***************************************************************************



ATOM RSS1 RSS2