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1996

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Subject:
From:
Michael Barmuta <[log in to unmask]>
Reply To:
Date:
Tue, 5 Nov 1996 15:43:54 -0800
Content-Type:
TEXT/PLAIN
Parts/Attachments:
TEXT/PLAIN (60 lines)
	Jim: Try Loctite's Output seies.It's a one component syringe	
	dispensable thixotropic system good to 300 F.Fixture time is	
	about 5 mins. however it does require an activator.		
	Loctite 1-800-562-8483						
									
					Regards				
					Michael Barmuta			
					Staff Engineer			
					Fluke Corp.			
					Everett Wa.			
					(206)356-6076


On Tue, 5 Nov 1996 11:33:00 -0800 JIM ENNIS wrote:

> From: JIM ENNIS <[log in to unmask]>
> Date: Tue, 5 Nov 1996 11:33:00 -0800
> Subject: Assy: Thermally Conductive Adhesive
> To: TechNet <[log in to unmask]>
> 
> 
> Question:  I need a thermally conductive adhesive to put under a QFP.  I 
> know that if I put it on prior to placement, it would screw up my 
alignment, 
> soldering, etc, I plan to add a hole (.100 to .125 dia) in the PCB under 
the 
> center of the part and apply the stuff after all assy is complete.
> 
> The adhesive properties are not important, in fact less is better. The 
stuff 
> should be viscous enough to fill the area under the part, but not run.  It 
> should be able to room temp cure in a reasonable time (2 hours or less) and 
> not bloom out onto the plastic body of the part.
> 
> Does anyone out there know of such a thing?
> 
> Thanks, in advance
> 
> Jim Ennis
> [log in to unmask]
> 
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