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Date: | Tue, 5 Nov 1996 15:43:54 -0800 |
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Jim: Try Loctite's Output seies.It's a one component syringe
dispensable thixotropic system good to 300 F.Fixture time is
about 5 mins. however it does require an activator.
Loctite 1-800-562-8483
Regards
Michael Barmuta
Staff Engineer
Fluke Corp.
Everett Wa.
(206)356-6076
On Tue, 5 Nov 1996 11:33:00 -0800 JIM ENNIS wrote:
> From: JIM ENNIS <[log in to unmask]>
> Date: Tue, 5 Nov 1996 11:33:00 -0800
> Subject: Assy: Thermally Conductive Adhesive
> To: TechNet <[log in to unmask]>
>
>
> Question: I need a thermally conductive adhesive to put under a QFP. I
> know that if I put it on prior to placement, it would screw up my
alignment,
> soldering, etc, I plan to add a hole (.100 to .125 dia) in the PCB under
the
> center of the part and apply the stuff after all assy is complete.
>
> The adhesive properties are not important, in fact less is better. The
stuff
> should be viscous enough to fill the area under the part, but not run. It
> should be able to room temp cure in a reasonable time (2 hours or less) and
> not bloom out onto the plastic body of the part.
>
> Does anyone out there know of such a thing?
>
> Thanks, in advance
>
> Jim Ennis
> [log in to unmask]
>
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