TECHNET Archives

1996

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
Date:
Tue, 26 Mar 1996 09:05:25 -0500
Content-Type:
text/plain
Parts/Attachments:
text/plain (22 lines)
Nancy,

IPC-TM-650 microsection methods 2.1.1, manual microsectioning
is the one referenced in the 276 document.  This doesn't have 
figures illustrating the exact measuring locations, however the
6.1 para addresses that thickness should not be determined 
at nodules , voids, cracks or irregular and thin platings.

If your hole wall was very rough, you might have nodules where
the plating was thicker than others and deep folds where the
plating thinned.  These would not be indicative of the actual
deposit if the hole wall was not rough.  The thin areas are considered
ok, if they do not go below 0.0008".

Hope this helps

Susan Mansilla
Robisan Laboratory
317-353-6249



ATOM RSS1 RSS2