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Subject:
GEN: Shipping/Transportation for Electronic Components
From:
[log in to unmask]
Date:
Thu, 19 Dec 1996 11:01:39 -0600
Content-Type:
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     TechNet,
     
     Searching for comprehensive packaging guidelines, procedures, 
     standards, handbook, etc. for shipping/handling/transportation of 
     electronic components (DIP's, SMD's, etc.).
     
     Are their generally accepted practices (ASTM, IPC, MIL, etc)for 
     packaging and materials methods used in providing optimum protection 
     to the product (physical support and transportation hazards such as 
     ESD) ?
     
     
     D.Drake
     
     
     
     
     
     
     
      
     

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