On your multilayers, do you use <copper> foil lam or core <double
     sided> construction?  If you use core construction you may want to
     check into how well you remove/clean the outer oxided surfaces before
     electroless copper. Also check the copper surface before image.
     Tape test. If you get toooooo much e-less copper coming off then
     there's your adhesion problem.
     
     
     Groovy
______________________________ Reply Separator _________________________________
Subject: Disscussion on seepage /resist lifting problem in 4/4mil and
Author:  [log in to unmask] at SMTPLINK-HADCO
Date:    9/9/96 8:56 AM




    with respect to above mentioned problem i wud like to clarify that the
said defect is being noticed only in ML boards.The said problem is not
noticed to such an extent in DOUBLE SIDED RIGID boards for the same
complexity of the Product. Therefore we suspect strongly the ML lamination
process as a POTENTIAL CAUSE.Could any one throw some light on this

 

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