On your multilayers, do you use <copper> foil lam or core <double sided> construction? If you use core construction you may want to check into how well you remove/clean the outer oxided surfaces before electroless copper. Also check the copper surface before image. Tape test. If you get toooooo much e-less copper coming off then there's your adhesion problem. Groovy ______________________________ Reply Separator _________________________________ Subject: Disscussion on seepage /resist lifting problem in 4/4mil and Author: [log in to unmask] at SMTPLINK-HADCO Date: 9/9/96 8:56 AM with respect to above mentioned problem i wud like to clarify that the said defect is being noticed only in ML boards.The said problem is not noticed to such an extent in DOUBLE SIDED RIGID boards for the same complexity of the Product. Therefore we suspect strongly the ML lamination process as a POTENTIAL CAUSE.Could any one throw some light on this *************************************************************************** * TechNet mail list is provided as a service by IPC using SmartList v3.05 * *************************************************************************** * To unsubscribe from this list at any time, send a message to: * * [log in to unmask] with <subject: unsubscribe> and no text. * *************************************************************************** *************************************************************************** * TechNet mail list is provided as a service by IPC using SmartList v3.05 * *************************************************************************** * To unsubscribe from this list at any time, send a message to: * * [log in to unmask] with <subject: unsubscribe> and no text. * ***************************************************************************