TECHNET Archives

1996

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
"ddhillma" <[log in to unmask]>
Date:
Mon, 13 May 96 10:32:13 cst
Content-Type:
text/plain
Parts/Attachments:
text/plain (41 lines)
     Good Morning TechNet!
     
     Norm - We have been using heat sealing with desiccant packs for some 
     period of time now and not had any issues with solderability. Our 
     finishes are primary hot solder dipped tin/lead. The heat sealing of 
     plastic parts to prevent "popcorning" is being used by several 
     companies I know with little to no problems concerning solderability. 
     I am curious on what the details are surrounding the "problem" heat 
     sealing examples. Are they isolated cases?
     
     
     Dave Hillman
     Rockwell Collins
     [log in to unmask]
     


______________________________ Reply Separator _________________________________
Subject: GEN: Heat - Sealing?
Author:  [log in to unmask] at ccmgw1
Date:    5/10/96 6:56 PM


     
     It seems to be generally accepted that storing PWB's in a heat sealed 
bag reduces solderability, can that same concern be extended to stored 
components?
     What about components with solderable plating other than tin-lead?  Is 
there any solderable plating that is not affected adversely by heat sealing 
the storage bag?
     Were the negative rumors about heat sealing started by some disgruntled 
heat seal manufacturing employee?
     Since nothing turned up in a search of the achieves, I'm interested in 
any comments.
     
     Norm Dill
     [log in to unmask]
     



ATOM RSS1 RSS2