What direction is the question slated toward? Are you worrying about 
     diffusion of the copper into the gold? Are you concern about cracking 
     of the nickel under stress? What is the application? Please fill in 
     some more details!
     
     
     
     Dave Hillman
     Rockwell Collins
     [log in to unmask]


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Subject: Electroless Nickel
Author:  [log in to unmask] at ccmgw1
Date:    5/9/96 9:00 PM


     We are looking for testing which has been done to determine the 
     minimum electroless nickel thickness to be used as a barrier layer 
     between copper and gold.  Please respond with data.