To all,
     
     In reference to IPC-D-275 Section 4.2.1.2 Clinched Leads (Type 1) the third 
     paragraph states "Type 1 is not applicable to leads of dual-inline packages 
     (DIPs)...." Q
     
     Question: What are the technical reasons why Type 1 clinching is not 
     considered applicable for DIP packages ?  
     
     We have a customer who has designed a Class 3 board where all DIP packages 
     (as well as all pins for each DIP) are PTH with full clinch pads, the 
     clinch is towards the body. 
     
     Are there mechanical advantages to this method ? 
     
     What are the disadvantages ?
     
     This board is subject to both high temperature and high vibration.
     
     Any advise would be helpful.
     
     Thanks
      
     D.Drake