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| Date: | Thu, 17 Oct 1996 11:27:15 +0000 |
| Content-Type: | text/plain |
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This is a similar question to the loose hardware after wave
solder issue.
If a stainless steel pressed-in pem nut were to undergo a forced
convection reflow cycle, would the pushout / torque-out force be any
less than if it were installed after reflow? The board material is
FR-4. The hole is unplated and is properly sized for the pem nut.
Thanks in advance.
Peter Wong
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