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| Date: | Thu, 19 Sep 1996 09:23:54 -0400 |
| Content-Type: | text/plain |
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We are considering using a component placement chip shooter to place QFP
packages. The two quad flat pack components are 80 lead, 0.8 mm pitch and
100 lead, 0.65 mm(25 mil) pitch. Does anyone have experience placing QFP
components of this size from tape & reel?
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