We are considering using a component placement chip shooter to place QFP packages. The two quad flat pack components are 80 lead, 0.8 mm pitch and 100 lead, 0.65 mm(25 mil) pitch. Does anyone have experience placing QFP components of this size from tape & reel? *************************************************************************** * TechNet mail list is provided as a service by IPC using SmartList v3.05 * *************************************************************************** * To unsubscribe from this list at any time, send a message to: * * [log in to unmask] with <subject: unsubscribe> and no text. * ***************************************************************************