Text item: 

If the pads are tied component side to solder side with adequate(large) 
PTH vias, wouldn't the pads take solder when run across the wave?



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     As mentioned in several other messages, we have found no reliability
     problems associated with exposed copper on OCC assemblies.

     However, I have one question which I hope someone can answer:

     On some assemblies, we use grounded contact pads to ground
     shields/bulkheads, etc. The contact between the shield and the board is
     simply a metal tab on the shield that presses against a contact pad on
     the board. Is such a connection reliable if the pad is exposed copper
     (or copper with residual OCC after a couple of reflow cycles and an
     aqueous wash)as opposed to HASL? Pasting those pads is not possible in
     all applications due to the size, number of pads, etc.

     Regards,


     Denis Mori
     Hewlett-Packard Co.
     Roseville, CA
     [log in to unmask]

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Subject: Exposed Copper on Assemblies
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