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Subject:
Ni/Au SMP mounting
From:
[log in to unmask] (MR DOUGLAS C JEFFERY)
Date:
Mon, 08 Jan 1996 22:04:23 EST
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-- [ From: Doug Jeffery * EMC.Ver #2.10P ] --

Help,

We have been looking into using electroless ni/au smp surfaces instead
of solder..I was wondering if anyone had a recommendation on how much
ni is required.  

Is it the same as a tab application?  Is it minimual like the gold? 
How much ni do you have to have to prevent any migration? How much ni
is too much?

Thanks for your input...

Doug Jeffery
Electrotek

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