Reply to:   RE>Ni/Au SMP mounting
Doug:

100-150 micro-inches of Ni followed by 3-5 micro-inches of Au will do the job
without causing solder joint embrittlement.

If the object is flat pads for fine pitch components, why not specify the OSP
coating ENTECH-106A by Enthone-OMI? It is cheaper than either NI/AU or HASL,
requires less processing steps and thermal cycles, has >2 year of unassembled
shelf life and most PCB vendors have it as a copper coating option.  Also,
there is NO process changes required for assembly.  It is compatable with
virtually all solder pastes and solders currently being used in SMT assembly.

Bill Fabry
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--------------------------------------
Date: 1/8/96 7:34 PM
To: Bill Fabry
From: MR DOUGLAS C JEFFERY
-- [ From: Doug Jeffery * EMC.Ver #2.10P ] --

Help,

We have been looking into using electroless ni/au smp surfaces instead
of solder..I was wondering if anyone had a recommendation on how much
ni is required.  

Is it the same as a tab application?  Is it minimual like the gold? 
How much ni do you have to have to prevent any migration? How much ni
is too much?

Thanks for your input...

Doug Jeffery
Electrotek




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