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1996

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Subject:
SMT Solder Joint Film
From:
"Knowles, Ed" <[log in to unmask]>
Date:
15 Oct 1996 09:44:02 -0600
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We are noticing a film on our SMT solder joints.  It doesn't seem to 
affect ionic cleanliness or conformal coating adherence, but can only 
be removed mechanically with a brush or Q-tip.  It has a slightly 
yellowish color in most cases and appears powdery.  Is this 
contamination from the PWB pads or part leads floating to the top, or 
a compound derived from the solder paste (63/37 RMA)?  Any insight 
into what this contamination is would be appreciated.
Thanks.

Ed Knowles
Lockheed Martin Astronautics

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