> DATE:       23 August 1996
>   SUBJECT:    re-filling vias with RESIN
>   REFERENCE:  question previously
>
>    I believe someone was looking for a way to completely fill vias
>    with RESIN (not the sequential blind via type).
>
>    For whoever was interested, there is a company in France called
>    LAPE who are subcontractors for pcb fabrication processes including
>    soldermask, HASL etc processes. One of the processes that they
>    offer is via hole injection filling, where they use a CNC
>    controlled, syringe injection system for filling holes with resin.
>
>    More details from LAPE on +33 (1) 60 86 51 83 or
>                          fax +33 (1) 60 86 51 80
>
>
>    Dougal Stewart
>    Product development manager
>    Exacta Circuits
>    Scotland
Component Intertechnologies can fill vias with copper using a forming 
process. If this is of any interest please contact me.

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