Jim
Finding a sporadic lifting problem is very difficult without following every panel on an order and checking surface cleaning and exit temperature of the laminator.

Oxidation can cause minor lifting on small amounts of panels (usually one side only).

Bristle brush scrubbing, when the bristles are too coarse, can leave grooves that liquid can seep under.

Make sure that no LPI soldermask is processed through the same developer solution.  No matter what your LPI supplier says, this does cause some lifting.

We rep Dynachem film and if you have any other questions, feel free to get in touch with me through TechNet or see below for other ways.

Ed

===============================================
Ed Wright 	Technical Service - OS-TECH Sales
Oliver Sales Company 	Phone:  (214) 231-1522
13445 Floyd Circle 	Fax:  (214) 644-3585
Dallas, Texas  75243-1503	
E-mail:  [log in to unmask]
===============================================

----------
From:  Jim Moritz[SMTP:[log in to unmask]]
Sent:  Friday, September 13, 1996 7:25 AM
To:  [log in to unmask]
Subject:  Dry Film Breakdown

We are experiencing sporadic dry film breakdown using Dynachem HG 2 mil film. The laminators have been thoroughly checked out so we don't suspect them and. The problem we are seeing is what looks like a seeping under the film in copper plating. When the panels are completed the traces are somewhat irregular and not as crisp edged as normal. What is frustraing is that this happens so sporadically and may only affect a couple of panels out of a long run or all panels in a short run.
Any suggestions would be greatly appreciated.
Jim Moritz
ES&D

***************************************************************************
* TechNet mail list is provided as a service by IPC using SmartList v3.05 *
***************************************************************************
* To unsubscribe from this list at any time, send a message to:           *
* [log in to unmask] with <subject: unsubscribe> and no text.        *
***************************************************************************



***************************************************************************
* TechNet mail list is provided as a service by IPC using SmartList v3.05 *
***************************************************************************
* To unsubscribe from this list at any time, send a message to:           *
* [log in to unmask] with <subject: unsubscribe> and no text.        *
***************************************************************************