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| Date: | Sat, 22 Jun 1996 03:45:33 -0400 |
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Date : 22/6/96 10:54
Msg From: ATUL RASTOGI
We are evaluating the possibility of using pallets for the assembly
of PCMCIA and Flex Circuit boards.These assemblies have to undergo
complete SMT process from Paste print to reflow on these pallets.
Can anyone there suggest us what kind of material to be used for
these pallets which can give necessary coplanarity required for Paste
print application and can withstand high temperatures in Reflow and
where this material can be available.
Thanks in advance
Atul Rastogi
Altos India Ltd
Altos India Ltd
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