It has been our procedure to bake flex circuits (Kapton) for 2 hours at 
100 degrees C. prior to assembly and solder reflow in order to drive off 
any entrained moisture. 
A question has come up as to what is the recommended length of time the 
parts can remain in the asssembly environment prior to a re-bake being 
necessary. 
We would appreciate hearing what the conventional wisdom is from you 
TechNetters.

Regards

Sherman Banks
[log in to unmask]
408/481-6047

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