It has been our procedure to bake flex circuits (Kapton) for 2 hours at 100 degrees C. prior to assembly and solder reflow in order to drive off any entrained moisture. A question has come up as to what is the recommended length of time the parts can remain in the asssembly environment prior to a re-bake being necessary. We would appreciate hearing what the conventional wisdom is from you TechNetters. Regards Sherman Banks [log in to unmask] 408/481-6047 *************************************************************************** * TechNet mail list is provided as a service by IPC using SmartList v3.05 * *************************************************************************** * To unsubscribe from this list at any time, send a message to: * * [log in to unmask] with <subject: unsubscribe> and no text. * ***************************************************************************