We are reviewing our SMT pad patterns and would like to evaluate them 
based on the volume of solder AFTER reflow. I understand a rule-of thumb 
for volume after reflow relative to volume before reflow is approximately 
50%. However, I feel like I need more precise information. 

Can someone tell me what the relationships are, or where to find a 
reference, for volume after reflow based on per cent metal content 
(88-92%) of the paste and particle size distribution (Type II or III)?

Thanks in advance

Regards

Sherman Banks
[log in to unmask]
408/481-6047

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