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1996

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Subject:
From:
"Scott B. Westheimer" <[log in to unmask]>
Date:
Thu, 19 Dec 1996 17:48:07 +0800
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From: Scott Westheimer
Date: 12/19/96

What does you hull cell show in the way of brightener levels? Do you see
burning on the hull cells in the high and low current density areas. Have
you checked your chloride levels and you anode bags? What copper brightener
do you use? How far are the anodes from the cathodes, is this a new bath
and if not  has the problem always been there?  

----------
> From: Timothy Gaylor <[log in to unmask]>
> To: [log in to unmask]
> Subject: Copper plating
> Date: Thursday, December 19, 1996 11:04 AM
> 
> We have been exhibiting miniature size nodules on our panels for quite
> some time. These miniatue nodules resemble a slightly high brightner
> burn. 
> I was wondering if anybody can give me a few suggestions to where I
> should look. 
>  
> Afew test I have ran were with bare laminate through a scrubber before
> plating. Nodules appeared on them. 
>  
> Afew more experiments were ran through different preclean lines and all
> led to the same result, nodules.
> 
> My questions if anybody could help are:
> 1. Would a rectifier with too high ripple affect the leveling of copper
> plating?
> 2. We currently hot load our racks into the bath, the program is set up
> with a five second lag  and raises from 0 amp to calculated amperage. So
> the panel sees 5 seconds of 0 amps before the rectifier applies voltage.
> Could this be a contributor? 
> 
> Timothy Gaylor
> 
>
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