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1996

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Subject:
From:
<[log in to unmask]> (James Kenny)
Date:
Wed, 25 Sep 96 0:28:18 EDT
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Perhaps HASL is not the surface finish that should be used in your assembly 
process? HASL is not a plated finish so there will be wide variations in the 
coating thickness. Electroless Nickel / Immersion Gold or organic coatings 
will always have the best surface uniformity.





[log in to unmask] Wrote:
| 
| Does anybody know what is the tin-lead HASL plating 
| thickness requirements 
| for printed circuit boards?   Do you have any standards 
| which specified it? 
|  IPC-A-600D specified only the minimum plating thickness,  
| which is 0.005mm 
| or 0.0002" for our application.
| We are having a problem with  the circuit board which 
| plating thickens is 
| greater than the other ones.   Also,  the plating surface 
| is not  flat.  
| This is not the fine pitch components board.  But,  when 
| pads are so 
| "bumpy" and plating is thicker than other boards,  the 
| adhesive dots 
| application  becomes difficult.   Glue dispenser shall be 
| adjusted for the 
| proper adhesive dots size.
| It would be greatly appreciated if anyone could give me 
| any directions.
| 
| 
|  
| 
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