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Date: | 25 Oct 96 14:48:39 PDT |
Content-Type: | text/plain |
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It has been our procedure to bake flex circuits (Kapton) for 2 hours at
100 degrees C. prior to assembly and solder reflow in order to drive off
any entrained moisture.
A question has come up as to what is the recommended length of time the
parts can remain in the asssembly environment prior to a re-bake being
necessary.
We would appreciate hearing what the conventional wisdom is from you
TechNetters.Regards
Sherman Banks
[log in to unmask]
408/481-6047
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