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25 Oct 96 14:48:39 PDT |
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by ipc.org (Smail3.1.28.1 #2)
id m0vGuDI-0000QzC; Fri, 25 Oct 96 16:54 CDT |
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25-Oct-1996 14:57:03 -0700; at NGM1.Trimble |
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| From [log in to unmask] Mon Oct 28 09: |
11:44 1996 |
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It has been our procedure to bake flex circuits (Kapton) for 2 hours at
100 degrees C. prior to assembly and solder reflow in order to drive off
any entrained moisture.
A question has come up as to what is the recommended length of time the
parts can remain in the asssembly environment prior to a re-bake being
necessary.
We would appreciate hearing what the conventional wisdom is from you
TechNetters.Regards
Sherman Banks
[log in to unmask]
408/481-6047
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