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Date: | Sat, 9 Nov 1996 19:42:18 -0500 (EST) |
Content-Type: | TEXT/PLAIN |
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Hi folks!!! Looking for some standards for HASL of PCB's.
Having some difficulty educating customers about crowning,
puddling, heavy solder coating, etc. Obviously, with some
20 mil pitch lead devices, placement is a challenge--at best.
With a convection oven, it becomes very interesting. Does
anyone out there have similar problems?
What are people specifing for pad height of HASL solder?
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