We have been using ESP no-clean paste without nitrogen for four years now.
We had used RMA/Freon previously.  We have had better solderability w/ the
ESP than we ever did with the RMA/Freon process.

It's my understanding that if you select the correct paste, and profile it
correctly, you can get equally the same quality with or without nitrogen.
What nitrogen will do for you is allow you to use fluxes which are less
aggressive and which will be less visible at the end of the process.



At 15:39 11/19/96 EST, Hollandsworth, Ron wrote:
>     What quality results have been noted as a result of 
>     processing SMT boards, using no-clean paste, without the aid 
>     of nitrogen?  How much effect does the inert environment 
>     have versus processing SMT boards in an air environment?
>     
>     We are currently equipped with an IR reflow oven and an IR 
>     convection style reflow oven.  Neither are nitrogen 
>     equipped.  
>     
>     We are also in the process of experimenting with no-clean 
>     fluxes at the present time.  What are the preferences as far 
>     as fluxes?  Currently we are readying ourselves to look at 
>     Kester 244-c, ESP, Indium, Qualitec, and Alpha.  We have 
>     dense mixed technology boards and some 100% SMT boards.  
>     Need some help.  Thanks
>     
>     Ron Hollandsworth
>     IR&D Operations Task Leader
>     [log in to unmask] 
>
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-Pat-

-------------
Patrick McGuine
Nicolet Instrument
[log in to unmask]
(608) 276-6334

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