To:dhickey							
		I've been off on vacation and just got back,which allowed me	
		to read this thread at one sitting.At the risk of aleinating	
		the readers of this net with even more stuff on peeling 
		soldermask and because you've been so cooperative in answer	
		ing questions so far let me ask a few more.		
		1.What is the topside temp of the board just prior to enter	
		ing the wave/temp of the wave/time in the wave?		
		2.Are these boards processed thru other high temp operations	
		i.e. reflow prior to flowsolder or run over the wave more 
		than once?						
		3.Which side(s)of the boards is the mask coming off?	
		4.Where is it coming off; groundplanes,circuits,laminate,	
		same general area,random etc.?				
		5.Is the type/supplier of the mask common to all three	
		fabricators?						
		6.Have you measured the thickness of the mask in the areas it	
		is coming off?   					
									
		If I were to pre-quess your answers and hypothesis it would	
		be this:The mask is coming off the bottom side of the board	
		in medium to larger metal areas.The mask could be thin	
		(<0.6 mils)in these locations.If using a low solids or 	
	  	or no clean flux that sees excessive preheat or dries	
		out prior to passing over the wave it provides minimal 	
		thermal protection and or lubricity.This can result in 	
		delamination of the mask from the copper in these thinner	
		weaker areas.Just a guess.				
									
					Regards				
					Michael Barmuta			
					Staff Enguneer			
					Fluke Corp.			
					Everett Wa.			
					(206)356-6076			 

> From: [log in to unmask]> Date: Tue, 10 Dec 1996 08:47:02 -0800
> Subject: Re[4]: Soldermask peeling
> To: [log in to unmask]
> 
>      We don't clean our boards after assembly. We use an Alpha no 
>      clean flux, SM351. The peel is noticed immediately after 
>      wave. It doesn't affect all boards. In a controlled test 3 
>      out of 12 peeled. 
>      This is a SMOBC, LPI soldermask. Raw boards are stored at 70 
>      Degree F at 10-15% humidity. We don't bake prior to assembly.
>      Of the Suppliers boards that failed, two of the three were 
>      received and processed within one week.
> 
> 
> ______________________________ Reply Separator 
_________________________________
> Subject: Re: Re[2]: Soldermask peeling
> Author:  [log in to unmask] at Internet
> Date:    12/10/96 8:40 AM
> 
> 
> The one thing that concerns me is your comment
> that you (an assembler) are experiencing the problem 
> with more than one board fabricator.  To me that 
> indicates that the cause is the assembly process rather 
> than having all fabricators exhibiting the same problem 
> at the same time.
>      
> Does the mask peel immediately after assembly or 
> is it noted after cleaning
>      
> Susan Mansilla
> Robisan Labs
> 317-353-6249
>      
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