Rudy,

I believe the primary reason is that it is Flat.  Finish flatness is 
critical to many SMT component placements and if the assembler can solve 
the other issues you mention they might have a winner. I do know a 
company that customer was requesting a very thin unfused tin-lead plate 
for flatness issues.

Regards
__________________________________________________

David W. Bergman, V.P. of Technical Programs
IPC
2215 Sanders Road
Northbrook, IL  60062-6135
847-509-9700 x340 Phone
847-509-9798 Fax
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On Thu, 17 Oct 1996 [log in to unmask] wrote:

> Recently had occaision to have some problems associated with recovering
> scrapped PCB's that have as final finish UNFUSED plated Tin or Solder (wasn't
> sure which).  Is there anyone who can enlighten me as to why an
> assembler/user would want such a finish.  The finish oxidizes heavily, and
> quickly, and I suspect likely needs to be cleaned immediately before
> soldering, or alternately requires a flux so active that it will etch the
> substrate if not washed off in a few minutes....
> 
> Other than that, it is likely wonderful??
> 
> Can anyone help me understand this strange (to me) finish?
> 
> Rudy Sedlak
> 
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