We do not know what your current processes are, so no one can respond to your inquiry.

I assume with regard to your comment regarding layer count, that you are a PCB fabricator and NOT an assembler.  Is this correct?  If you are a fabricator, provide more detail:  what laminate types you currently process, lamination process overview, and hole preparation/plating process overview.  Also useful might be what marketplace you serve:  military or commercial; and aerospace vs. telecom vs. computer vs. other. Perhaps you will then get some responses of what processes might change.

Regards,
David Estes
Texas Instruments
PCB/PCBA Commodity Manager
Ph:  214-997-2942
Fax: 214-997-2188
e-mail:  [log in to unmask]

------------------
Original text

From: [log in to unmask], on 9/11/96 1:56 PM:
To: [log in to unmask]

Looking for information on processing teflon material thru our shop.  We do
double sided and multilayer   will we need to change any of our processes?
 What do we need to watch out for on the floor?
Is there any place I can get further information from?

Thanks for any help,
MJKad 

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