Address,
     
     We use .020 pitch devices extensively in our designs, 12mil lands
     with 8mil spacings.  The conductors widths coming from these 
     lands are 8mils (2.1 Cu thk; .0007 foil and .0014 plating).  In addition to
     other varibles, I believe the 8mil cond width is robbing much needed
     heat for solderability.  The 8mil cond width is out of context for 
     such lands and FPT devices.
     
     Q: How much influence does the conductor really have on the wetting
        of the land in reflow (No heavy copper planes in the 8 layer 
        lay-up)?
     
     Q: Is there a test that can be conducted to determine the amount
        heat absorbed by the land.
     
     I am in the process of convincing Hardware Design to reduce the 
     conductor width for the reason above, in addition to buying real 
     estate.
     
     Please advise.
     
     John Gulley
     [log in to unmask]
     972-578-3928
     

***************************************************************************
* TechNet mail list is provided as a service by IPC using SmartList v3.05 *
***************************************************************************
* To unsubscribe from this list at any time, send a message to:           *
* [log in to unmask] with <subject: unsubscribe> and no text.        *
***************************************************************************