>1) Has anyone determined the % moisture content in inner layers,
>presumably after oxide, that relates to potential delamination
>problems after lamination?


We did some testing of typical moisture levels about a year ago
with different pre lam baking. Our laminate supplier felt that a
ballpark figure of 1000 ppm could cause problems so the process
was set for time - temp. that gave us 500 ppm or less on the
samples. I think they tested by oven weight loss (2 hours 105 C
is one standard). The surface moisture by this number would
probably be of more use than a titration number.

This was only done for epoxy resin systems.



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Hallmark Circuits Inc.
San Diego, CA.

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