Greg Bartlett's advice is good. He did not mention, that it is best to
collect data from a significant sample size (25+) to get the mean from a
distribution. He is also correct in stating, that "this kind of test [cannot
be used] as a means of predicting reliability". It needs to be said however,
that if your pull test results are below what that should be, reliability
will be less than expected because you are likely having inadequate wetting
of your solder joints. But the reliability of good solder joints depends on
design parameters and the severity of the operating environment.

Werner Engelmaier
Engelmaier Associates, Inc.
Electronic Packaging, Interconnection and Reliability Consulting
23 Gunther Street
Mendham, NJ  07945  USA
Phone & Fax: 201-543-2747
E-mail: [log in to unmask]

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