INTERNATIONAL CONFERENCE ON ELECTRONIC ASSEMBLY: MATERIALS AND PROCESS 
CHALLENGES ANNOUNCED

The International Conference on Electronic Assembly: Materials and 
Process Challenges, cosponsored by the Institute for Interconnecting and 
Packaging Electronic Circuits (IPC) and the Georgia Institute of 
Technology has been announced.  The conference will be held May 29-31, 
1996, in Atlanta, Georgia, at Georgia Tech.  This conference is an 
outgrowth and expansion of the International Conference on Soldering 
Flux and Pastes, which was last held in 1994 at Georgia Tech and 
attracted over 150 electronics assembly experts and practitioners from 
North America, Europe, and Asia.  

"New materials and processes must be developed to meet the challenge of 
ball grid array and direct chip attach," says Dr. Laura Turbini, Georgia 
Institute of Technology and Conference Chairman.  "The process engineers 
who, in the past, were challenged by solder paste deposition for fine 
pitch attachment processes, are now dealing with BGA and planning for 
direct chip attach with polymer underfill."  

The program committee for this prestigious event also includes Alvin F. 
Schneider, Alpha Metals; Kathi Johnson, Hexacon Electric; Dr. Wallace 
Rubin, International Consultant; Tom Fujikawa, Malcolm Instruments; and 
David Bergman, IPC.  

For more information, contact Revonda Dunn, Georgia Tech at (404) 
894-3012 or Leslie Zaitz, IPC at 847/509-9700, ext. 320, or Dr. Laura 
Turbini at [log in to unmask]  A formal program brochure will 
be available in March.