We are seeing instances of solder wicking up our fine pitch leads and
causing minimal solder left in the joint to wet the board. What do most
companies do about solder wicking up fine pitch leads? What can be done to
minimize this phenomenon?  Does anyone have suggestions that have been
successful for you? 
Some background process info:
We profile at approximately 215-220 degrees c.
We are using RMA solder paste.
We are baking our boards (multilayer) prior to reflow soldering. They are
cool for the print cycle.
We are over 183 degrees c for approximately 70-80 seconds.
We are using a Vitronics 722 IR oven.

Any comments would be appreciated!!! Thanx!
----------------------------------
Jeffery L. Hempton              Phone: (219) 429-7335   Fax: (219) 429-4688
Hughes Defense Communications                           Mail Stop: 25-31
1010 Production Road, Fort Wayne, IN 46808-4106
Email: [log in to unmask]

"The reason most people do not recognize opportunity is because it is
usually wearing a pair of bib overalls and disquised as hard work."    -
-Thomas Edison

***************************************************************************
* TechNet mail list is provided as a service by IPC using SmartList v3.05 *
***************************************************************************
* To unsubscribe from this list at any time, send a message to:           *
* [log in to unmask] with <subject: unsubscribe> and no text.        *
***************************************************************************