From:  Stephen Ayotte
       EM Quality Engineering
       Bldg. 14-3 Col F5 5-1537
Subject: Reliability Testing
Does anyone have any experience with trying to find cracks in
surface circuitry on printed circuit boards.

I was once told that due to copper expansion that occurs as
elevated temperatures and the fact that metals shrink as lower
temperatures that the preferred method for finding surface cracks
that are in contact (creating continuity) is through low temperature
testing.

What experience has anyone had with this?

Thanks.

**** IBM MD Product Quality Engineer       ****
****       OEM Quality Engineer            ****
**** Interenterprise Address: USIB6CEF     ****
**** Internet Address: [log in to unmask] ****

***************************************************************************
* TechNet mail list is provided as a service by IPC using SmartList v3.05 *
***************************************************************************
* To unsubscribe from this list at any time, send a message to:           *
* [log in to unmask] with <subject: unsubscribe> and no text.        *
***************************************************************************