I personally find use in the Nepcon information.  
I'm especially surprised to see rude responses in this forum.  I
consider this a professional environment and appreciate having a
professional tone here, to all postings.  This forum is as good as the
members make it.

ddhillma wrote:
> 
>      If I needed to see an NEPCON Ad I could look at a NEPCON program
>      flyer! Keep the advertisement off TechNet and stick to the technical
>      format.
> 
> ______________________________ Reply Separator _________________________________
> Subject: Nepcon Workshops 1997
> Author:  [log in to unmask] at ccmgw1
> Date:    12/9/96 3:41 PM
> 
> Here are the workshops I will be conducting at Nepcon West in the USA if any one
> feels that a trip to the sun is of benefit.
> 
> This will be my 8th year at Nepcon West it will be time for my Gold Watch soon I
> also love the sun we get so little in the UK.
> 
> 
> Wave Soldering Surface Mount Boards with Zero Defects - Half Day 25th Feb
> 
> Soldering Materials for SMT - Fluxing for Conventional and Low Solids - Pre Heat
> Measurement Solder Waves for SMT - Process Control Testing - Establishing
> Process Settings - SMT Soldering Standards - Defect Analysis Clinic
> 
> 
> X-Ray Inspection of Fine Pitch and BGA - Half Day 25th Feb
> 
> Introduction to x ray inspection - Equipment requirement - Selection criteria -
> Inspection standards - BGA - Gull wing - J Lead - Chip terminations - Process
> defects - Operator training
> 
> 
> Design For Manufacture and Assembly - 24th Feb
> 
> Component selection and specification-Fine pitch and Ball Grid Array-PCB
> specification-Laminate selection-Track and hole sizes-Pad and stencil
> apertures-Pad sizes for conventional and SMT Resist selection for no
> clean-Solder finish and cost reduction-Multi panel design-Design reviews Layout
> for small and volume production-Process problems and solutions through design
> 
> 
> Introduction to Ball Grid Array Design and Assembly - 25th Feb
> 
> BGA advantages and disadvantages-BGA suppliers-Design rules-Printed board
> layout-Pad and resist footprints-Surface finish selection-Inspection/assembly
> marks-Assembly process-Solder paste printing Flux reflow methods-Temperature
> profiling-Reflow by convection and vapour phase-Moisture removal Rework
> procedures-BGA failures-Package cracking-Missing balls-Solder
> balls-Misalignment-Non reflow-Inspection criteria-Production trial results
> 
> Further information is available from the Nepcon Home Page.
> 
> Bob Willis
> Process Engineering Consultant
> Electronic Presentation Services
> 2 Fourth Avenue, Chelmsford, Essex CM1 4HA. England.
> Tel: (44) 01245 351502
> Fax: (44) 01245 496123
> Home Page: http://ourworld.compuserve.com/homepages/Bwillis
> Email: [log in to unmask]
> 
> 
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