TECHNET Archives

1996

TechNet@IPC.ORG
Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
FAB: Post-Lam Bake
From:
[log in to unmask]
Date:
Wed, 30 Oct 96 14:10:58 MST
Content-Type:
text/plain
Parts/Attachments:
text/plain (15 lines) 
     What is a typical cycle for baking FR4, rigid, multilayers after 
     lamination?
     Why is this bake necessary?
     
     Any information would be greatly appreciated.

***************************************************************************
* TechNet mail list is provided as a service by IPC using SmartList v3.05 *
***************************************************************************
* To unsubscribe from this list at any time, send a message to:           *
* [log in to unmask] with <subject: unsubscribe> and no text.        *
***************************************************************************

ATOM RSS1 RSS2