If I needed to see an NEPCON Ad I could look at a NEPCON program 
     flyer! Keep the advertisement off TechNet and stick to the technical 
     format.


______________________________ Reply Separator _________________________________
Subject: Nepcon Workshops 1997
Author:  [log in to unmask] at ccmgw1
Date:    12/9/96 3:41 PM


Here are the workshops I will be conducting at Nepcon West in the USA if any one
feels that a trip to the sun is of benefit. 
     
This will be my 8th year at Nepcon West it will be time for my Gold Watch soon I
also love the sun we get so little in the UK.
     
     
Wave Soldering Surface Mount Boards with Zero Defects - Half Day 25th Feb
     
Soldering Materials for SMT - Fluxing for Conventional and Low Solids - Pre Heat
Measurement Solder Waves for SMT - Process Control Testing - Establishing 
Process Settings - SMT Soldering Standards - Defect Analysis Clinic
     
     
X-Ray Inspection of Fine Pitch and BGA - Half Day 25th Feb
     
Introduction to x ray inspection - Equipment requirement - Selection criteria - 
Inspection standards - BGA - Gull wing - J Lead - Chip terminations - Process 
defects - Operator training
     
     
Design For Manufacture and Assembly - 24th Feb
     
Component selection and specification-Fine pitch and Ball Grid Array-PCB 
specification-Laminate selection-Track and hole sizes-Pad and stencil 
apertures-Pad sizes for conventional and SMT Resist selection for no 
clean-Solder finish and cost reduction-Multi panel design-Design reviews Layout 
for small and volume production-Process problems and solutions through design
     
     
Introduction to Ball Grid Array Design and Assembly - 25th Feb
     
BGA advantages and disadvantages-BGA suppliers-Design rules-Printed board 
layout-Pad and resist footprints-Surface finish selection-Inspection/assembly 
marks-Assembly process-Solder paste printing Flux reflow methods-Temperature 
profiling-Reflow by convection and vapour phase-Moisture removal Rework 
procedures-BGA failures-Package cracking-Missing balls-Solder 
balls-Misalignment-Non reflow-Inspection criteria-Production trial results
     
Further information is available from the Nepcon Home Page.
     
Bob Willis
Process Engineering Consultant
Electronic Presentation Services
2 Fourth Avenue, Chelmsford, Essex CM1 4HA. England. 
Tel: (44) 01245 351502
Fax: (44) 01245 496123
Home Page: http://ourworld.compuserve.com/homepages/Bwillis 
Email: [log in to unmask]
     
     
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