Subject:                              Time:  10:38 AM
  OFFICE MEMO         RE>IPC spec IPC-A-600D                Date:  2/21/96

To:  [log in to unmask]

You inquiried,  "We are wondering what is the latest rev of this
spec(IPC-A-600D).  We have one dated 9-25-89.  Specifically we are questioning
allowable plating voids in through holes.  Are circumferential voids
acceptable in current spec?  

Response follows:

Steve, the A-600 revision "E" was released about Sept '95.

The "E" rev. has two acceptance conditions for voids in the plated-through
hole and is based on the IPC-RB-276 paragraph 3.6.3:

1 - One set of conditions is where the void extends through all metal coatings
and exposes the printed board base material.

     Class 1 products, 3 voids, with no void greater than 10% of the hole
length in any direction.

     Class 2 products, 1 void, with the size of the void less than 5% of the
hole length in any direction.

     Class 3 products, no voids allowed.

     All classes, there shall be no circumferential voids greater than 90
degrees.

2 - Second set of conditions is where the void is in the finish or over
coating and does not penetrate into the primary current carrying
plated-through hole material.

     Class 3, five voids with no more than 15% of the holes in the printed
board with voids.

     Class 2, three voids with no more than 5% of the holes in the printed
board with voids.

     Class 1, one void, with no more than 5% of the holes in the printed board
with voids.

This should answer you query, if not please feel free to contact me.

Ralph Hersey
Lawrence Livermore National Laboratory
Phn: 510.422.7430
FAX:  510.424.6886
e-mail:  [log in to unmask]