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From: | "Jeff Seeger" <simon.ipc.org!bort.mv.net!rapidcad!jseeger> |
Date: | Thu, 1 Aug 96 15:05:46 EDT |
Content-Type: | text/plain |
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About stenciled adhesives (bond stencils):
We support two manufacturer's DFM specs that call for stenciled
adhesive. Both use rectangles for the "window", seemingly spec-
ified in terms of spacing to soldered feature up to a maximum
total size.
One puts a silkscreened feature under the part to help raise the
height of the adhesive.
Neither gives a standard for sot23 components, which do not lend
themselves to this; we've had to "punt" with an odd shape and have
had apparent success, we've not been asked to modify it.
This technique seems to be more common in the Pacific Rim than
on US shores.
Good luck,
Jeff Seeger Applied CAD Knowledge Inc
Chief Technical Officer Tyngsboro, MA 01879
[log in to unmask] 508 649 9800
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